Advantech has released its latest ROM-7510 Qseven module. It is powered by TI’s AM5728, consisting of dual ARM® Cortex®-A15 microprocessors and dual TI C66x™ DSP processors, enabling high computing processing capability, accelerated multimedia, and industrial communication. (more…)
February 6, 2018
Posted by: Zenobia Hegde
The tests specified as Type B by the GSMA are now part of the GCF mobile type approval program. “Manufacturers of consumer devices who want to use their smartphones, tablets, PCs, or smartwatches in the GSMA eSIM environment, now must prove that their devices correctly support switching of the operator. (more…)
February 5, 2018
Posted by: Zenobia Hegde
A new study from Juniper Research has found that global retailer spending on AI will reach $7.3 billion (€5.87 billion) per annum by 2022, up from an estimated $2 billion (€1.61 billion) in 2018, as retailers target new avenues to increase personalisation of the customer experience. (more…)
February 1, 2018
Posted by: Zenobia Hegde
To become part of the closed GSMA eSIM ecosystem, all applicants – meaning eSIMs, servers, and devices – must prove that they meet the GSMA requirements. “This ensures that the individual players authorise each other as ‘interlocutors’ and that they are able to communicate,“ explains Dr. Frank Oberhokamp, product manager eUICC Consumer Devices Test Solutions at Comprion.
Posted by: Zenobia Hegde
Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, says that the Digi® XBee3™ series of next-generation RF modules and cellular modems is now available. (more…)
January 31, 2018
Posted by: Zenobia Hegde
The UK Government is facing a ‘trilemma’; a struggle to provide secure, affordable and clean energy, all while preventing blackouts. This is a unique situation where the technology available to the sector is much more advanced than the infrastructure the industry is built on. (more…)
Posted by: Zenobia Hegde
Alpha Micro Components announced the availability of the new Laird 60 Series of certified 802.11ac 2×2 MU-MIMO Wi-Fi and Bluetooth v4.2 modules. The 60 Series modules are based on cutting-edge manufacturing techniques, which not only help developers and designers get the most out of today’s most powerful wireless connectivity technologies, (more…)
Posted by: Zenobia Hegde
Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)
January 30, 2018
Posted by: Zenobia Hegde
International lighting design company Klaasen Lighting Design (KLD), which has offices in Singapore, Perth, Shanghai and Jakarta, has entered into a partnership agreement with US-based data platform provider Gooee. (more…)
Posted by: Zenobia Hegde
Mitsubishi Electric Corporation announced that it has developed an autonomous platform that enables networked smart appliances to use their sensors and functionalities to co-operate in new home services without the need for cloud computing or internet connection. (more…)
January 29, 2018
Posted by: Zenobia Hegde