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Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV MEMS microphone

Munich, Germany. 12 November 2021 – Toposens has partnered up with Infineon Technologies AG to realise 3D obstacle detection and collision avoidance in autonomous systems using Toposens’ proprietary 3D ultrasound technology. (more…)

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November 12, 2021

Posted by: Anasia D'mello

Kerlink and VOMATEC collaborates on digital emergency management system for smart cities

Thorigne-Fouillard, France and Bad Kreuznach, Germany. 9 Nov, 2021– Kerlink, a specialist in solutions dedicated to the Internet of Things (IoT), and VOMATEC Innovations GmbH, a specialised provider of system and software solutions for emergency services, announced their collaboration on the integration of the digital MCI-management system RescueWave into LoRaWAN- based smart-city networks. (more…)

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November 10, 2021

Posted by: Anasia D'mello

Infineon enables highly integrated USB type-C charger unification

Munich, Germany. 25 October, 2021 – Using energy responsibly is the essential factor for innovations in the field of energy efficiency towards a greener planet. Infineon Technologies AG, the market provider of power semiconductors, is continuously investing and innovating in futureproof semiconductor technologies and solutions, enabling environmentally friendly applications as well as performance and ease of design. (more…)

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October 25, 2021

Posted by: Anasia D'mello

Sustainable AI computing for IoT

AI and Computing can, if not properly planned, be extremely heavy and wasteful of CPU resources. To put it in perspective, the computing power required for AI landmarks, such as recognising images or defeating humans at Go, increased 300,000-fold from 2012 to 2018. (more…)

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October 21, 2021

Posted by: Mattias Bergstrom

Stronger and safer edge AI solutions the goal for partners Advantech, Allxon and Trend Micro

IPC provider, Advantech, has launched edge AI (artificial intelligence) inference systems that meet rising demands for AI image recognition. As AI devices are widely deployed at the edge, remote management and information security at the cloud/edge remain key concerns. (more…)

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October 13, 2021

Posted by: Anasia D'mello

Smart TV voice assistant transactions to approach $500mn in 2023

A new study from Juniper Research has found that spend through voice assistant-enabled smart TVs will reach nearly $500 million (€432.02 million) in 2023; a sharp increase from the $126 million (€108.87 million) expected in 2021. This growth reflects how voice assistants are becoming context‑dependent sales portals, as well as information and control systems, and smart TVs will bring an important visual element to voice assistant purchases. (more…)

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October 11, 2021

Posted by: Anasia D'mello

HERE launches advanced real-time traffic service

HERE Technologies, the location data and technology platform, announced the launch of its new HERE Advanced Real-Time Traffic service. It introduces new lane-level information and expanding inner-city coverage to help drivers reach their destinations more efficiently and stress-free. (more…)

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Posted by: Anasia D'mello

Fueled by $200mn series C, Wiliot adds leaders to spearhead growth of ‘sensing as a service’ platform

Wiliot, which aims to transform the Internet of Things (IoT) with tiny computers that turn trillions of everyday products into intelligent communication devices through its “Sensing as a Service” platform, has announced significant additions to its executive leadership team. (more…)

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October 8, 2021

Posted by: Anasia D'mello

Tessian launches new solution ‘Tessian Architect’: The intelligent data loss prevention policy engine

Human Layer Security company Tessian has launched Tessian Architect, a new policy engine for real-time email data loss prevention (DLP). It provides automatic and custom policy capabilities, and real-time visibility into data loss events, without the cumbersome, manual rules found in traditional DLP solutions. (more…)

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October 6, 2021

Posted by: Anasia D'mello

New EasyPACK 2B EDT2 power module for traction inverters up to 50 kW

Infineon Technologies AG introduces the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A . With its featured specs, the module is optimised for inverter applications in hybrid and electric vehicles.

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October 4, 2021

Posted by: Anasia D'mello