Search Results

Search results for: environment

InfiNet wireless to showcase its latest technologies and developments for mobile and nomadic connectivity at MWC 2018

InfiNet Wireless, the global provider in fixed broadband connectivity, announced that it will be showcasing its latest solutions for uncompromised connectivity at Mobile World Congress (MWC) 2018. (more…)

Read more

February 14, 2018

Posted by: Zenobia Hegde

HARTING features efficiency improvements in manufacturing logistics based on Integrated Industry 4.0 and IoT

At Smart Industry Expo, HARTING is demonstrating its range of automation solutions for improving the efficiency of manufacturing logistic processes based on the concepts of Integrated Industry 4.0 and the Internet of Things (IoT) (Stand S244). (more…)

Read more

February 13, 2018

Posted by: Zenobia Hegde

Farnell element14 launches GraspIO Cloudio, a Raspberry Pi add-on board with Drag and Drop programming interface

Farnell element14, the Development Distributor, announces the launch of GraspIO Cloudio – a Raspberry Pi add-on board with Drag and Drop programming interface on iPhone, iPad, Android. Among other features, it incorporates Voice Assistant Capabilities, IFTTT (“If This Then That”) Integration, (more…)

Read more

February 12, 2018

Posted by: Zenobia Hegde

Validation of Comprion GSMA SGP.23 Type B Device Tests activates new GCF work item

The tests specified as Type B by the GSMA are now part of the GCF mobile type approval program. “Manufacturers of consumer devices who want to use their smartphones, tablets, PCs, or smartwatches in the GSMA eSIM environment, now must prove that their devices correctly support switching of the operator. (more…)

Read more

February 5, 2018

Posted by: Zenobia Hegde

Gemalto’s Discovery Service boosts on-demand connectivity activation for consumer devices worldwide

Gemalto, the provider in digital security, announces its new Subscription Management​ Discovery Service solution. This initiative sets new standards of freedom for all users of eSIM-connected devices, such as smartwatches, tablets, connected PCs and many more. (more…)

Read more

February 2, 2018

Posted by: Zenobia Hegde

Wireless mobility is the key to secure military communications, says Rajant CEO

Addressing delegates at the Network Centric Warfare Conference in Rome, Rajant Corporation CEO, Robert Schena, stressed that wireless mobility is the key to ensuring secure military communications. (more…)

Read more

Posted by: Zenobia Hegde

A reputation for innovation: Building business confidence for smart cities

Business leaders are increasingly recognising the importance of conditions external to their organisation when it comes to facilitating successful digital transformation initiatives. And in a continent as vast as Europe, businesses can choose from numerous locations when deciding where to operate. (more…)

Read more

Posted by: Zenobia Hegde

Chirp and EDF Energy secure £100k Innovate UK funding to trial data-over-sound solutions in nuclear power plants

Chirp, a data-over-sound provider, along with partner EDF Energy, has been awarded £100,000 (€114206.50) by Innovate UK to trial a new project taking place at the company’s Heysham 1 power station. (more…)

Read more

February 1, 2018

Posted by: Zenobia Hegde

Alpha Micro’s Laird 60 Series Wi-Fi and Bluetooth modules ready for today, and for the future

Alpha Micro Components announced the availability of the new Laird 60 Series of certified 802.11ac 2×2 MU-MIMO Wi-Fi and Bluetooth v4.2 modules. The 60 Series modules are based on cutting-edge manufacturing techniques, which not only help developers and designers get the most out of today’s most powerful wireless connectivity technologies, (more…)

Read more

January 31, 2018

Posted by: Zenobia Hegde

Renesas Electronics expands RX130 MCU lineup to enhance functionality for touch-based home appliances

Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)

Read more

January 30, 2018

Posted by: Zenobia Hegde