Munich, Germany. 14 December 2021 – Infineon Technologies AG announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s AIROC CYW30739 Bluetooth LE & 802.15.4 system on chip (SoC) is a reliable, secure and scalable solution to connect low-power devices in the smart home.