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Telit Cinterion expands 5G LPWA module portfolio with new modules featuring Sony’s altair ALT1350 chipset

Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)

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March 3, 2023

Posted by: Shriya Raban

Rohde & Schwarz, Broadcom extend test collaboration for latest Wi-Fi 7 access point chipsets

Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)

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Posted by: Shriya Raban

European Commission aims to deliver Gigabit connectivity to citizens, businesses across EU

Today, Commission has presented a set of actions aimed to make Gigabit connectivity available to all citizens and businesses across the EU by 2030, in line with the objectives of Europe’s Digital Decade, and to enable the transformation of the connectivity sector in the EU. (more…)

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Posted by: Shriya Raban

Qualcomm selects Adobe to enhance customer relationships with real-time personalisation

Adobe has announced a collaboration with Qualcomm Incorporated to help fuel its digital strategy and that of its affiliated companies. (more…)

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March 2, 2023

Posted by: Shriya Raban

Thales partners with L&T, Qualcomm to enable 5G private networks in urban railways

L&T Technology Services Limited, a global pure-play engineering services company, has announced it has been selected by Thales to offer 5G driven next-gen connectivity solutions, which will include collaboration with Qualcomm Technologies, Inc., allowing it to provide solutions for the benefit of urban railway operators. (more…)

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Posted by: Shriya Raban

SECORA Connect X payment solution for ultra-small devices enables NFC wireless charging

Munich, Germany – Smart wearables and IoT devices are becoming increasingly popular for a variety of applications as they offer more functionality despite severe space and power constraints. By adding NFC capabilities to wearables, they can be used to pay in stores or gain access to public transportation and office buildings. SECORA Connect X, an all-in-one turnkey NFC solution from Infineon Technologies AG, supports this trend. (more…)

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Posted by: Janmesh Chintankar

NTT develops ultra-compact baseband amplifier IC module with built-in DC block function, 100GHz bandwidth performance

NTT Corporation has developed an ultra-compact baseband amplifier IC module with an ultra-broadband performance of 100GHz. This technology is expected to be used in future all-photonics networks, namely IOWN and 6G, and fields achieving measurements since they will require an ultra-broadband signal amplification function rid of distortion. (more…)

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March 1, 2023

Posted by: Shriya Raban

UL Solutions safety scientists to work on automotive cybersecurity, functional safety automation processes

UL Solutions, a global provider of applied safety science, has announced that it is leveraging its collective expertise to drive innovation in automotive safety by combining members of its functional safety and cybersecurity teams to enable a more holistic approach to testing, inspection and certification for automotive safety. This new interdisciplinary team provides a well-rounded approach to addressing advanced mobility technologies. (more…)

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February 28, 2023

Posted by: Shriya Raban

Sequans, Thales partner to deliver integrated SIM solution supporting latest GSMA eSIM IoT standard

Paris, France. 23 February 2023 – Sequans, a provider of cellular IoT chip technology, and Thales, a provider of digital security, are partnering to bring to market a new integrated SIM (iSIM) solution supporting the latest GSMA SGP.31/.32 eSIM IoT specifications on Sequans LTE-M/NB-IoT Monarch 2 chip. The new version of the GSMA standard leverages industry experience with GSMA’s M2M and consumer eSIM architectures to bring a more advanced remote SIM provisioning architecture that is fully suitable for any IoT device. This gives service providers and OEMs/ODMs more flexibility to manage manufacturing, deployment, and operations of massive fleets of IoT devices without heavy investment. (more…)

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Posted by: Shriya Raban

Snowflake debuts Telecom Data Cloud to increase monetisation, operational efficiency

Snowflake, a data cloud company, has announced launch of the Telecom Data Cloud, which unites Snowflake’s data platform, Snowflake- and partner-delivered solutions, and industry-specific datasets. The Telecom Data Cloud helps telecommunications service providers break down data silos within companies and across the ecosystem, allowing organisations to easily and securely access data in near real-time, enrich it with machine learning (ML) models, and then share and analyse it to drive better decisions. With the Telecom Data Cloud, Snowflake and its ecosystem of partners can help telecommunications service providers accelerate digital transformation, enable superior customer experiences, maximise operational efficiency, and monetise new data services. (more…)

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February 27, 2023

Posted by: Shriya Raban