ScaleOut Software announced extensions to its ScaleOut Digital Twin Streaming Service that enable real-time digital twin software to implement and host machine learning and statistical analysis algorithms that immediately identify unexpected behaviors exhibited by incoming telemetry. Real-time digital twins can now make extensive use of Microsoft’s ML.NET machine learning library to implement these groundbreaking capabilities for virtually any IoT device or source object. (more…)
November 18, 2021
Posted by: Anasia D'mello
Dusseldorf, 9 November , 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, introduced a powerful new group of microcontrollers (MCUs), the RH850/U2B MCUs, designed to address the growing need to integrate multiple applications into a single chip and realise a unified electronic control unit (ECU) for the evolving electrical-electronic (E/E) architecture.
November 10, 2021
Posted by: Anasia D'mello
The pandemic has changed the way we interact with technology and how we use it in our everyday lives. Assurant has found as people commit to connected devices they have a much more positive outlook on smart technology as a whole. This means the changes people have made out of necessity in the pandemic will lead to people voluntarily embracing a more connected living life. (more…)
November 9, 2021
Posted by: Anasia D'mello
Santa Clara, California. 2 November, 2021 – Arista Networks announced the next major expansion of the Arista EOS network stack with the introduction of the EOS Network Data Lake (NetDL). Coupled with the AI/ML-driven Autonomous Virtual Assist (Arista AVA) and a broad ecosystem of industry providers, Arista is extending the EOS network stack architecture to provide a high-fidelity data lake capability for the next era of data-driven networking. This novel foundation supports a wide variety of applications to interact, analyse, and enrich network data for best-of-breed enterprise solutions. (more…)
November 2, 2021
Posted by: Anasia D'mello
Tokyo, Japan, October 28, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced it has entered into a definitive agreement with Celeno Communications, a provider of smart Wi-Fi solutions, for Renesas to acquire Celeno in an all-cash transaction. The deal values Celeno at approximately US$315 million (€269.87 million or approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar), assuming certain milestone payments are made as detailed in the agreement.
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October 28, 2021
Posted by: Anasia D'mello
LONDON, UK. 27 October 2021—Fuze, the cloud-based communications provider for the modern global enterprise, announced platform enhancements built to deliver improved communication and collaboration for the growing hybrid workforce. (more…)
Posted by: Anasia D'mello
27 October, 2021 – GlobalPlatform, the standard for secure digital services and devices, has announced the appointment of Ana Tavares Lattibeaudiere as executive director. Ana brings 20+ years of industry knowledge, non-profit strategy and business development to the role. After spells at Accenture, BCG and Deloitte, Ana spent 15 years in various roles at GSMA. Most recently she held the position of head of North America, responsible for driving global initiatives across eSIM, future networks, IoT, RCS, identity and diversity. (more…)
October 27, 2021
Posted by: Anasia D'mello
Dusseldorf, October 26, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that its R-Car H3 and R-Car M3 system-on-chips (SoCs) have been adopted by Toyota Motor Corporation for their next-generation multimedia systems. (more…)
October 26, 2021
Posted by: Anasia D'mello
Lanner was approached by a customer searching for the ideal hardware appliance capable of supporting the deployment of a K-12 education system, one that serves millions of students and teaching staff residing both inside and outside the country. (more…)
October 22, 2021
Posted by: Anasia D'mello
Düsseldorf. October 21, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth® 5.3 Low Energy (LE) Specification.
Posted by: Anasia D'mello