CALLUP, a global provider of Value Added Services (VAS) and Mobile Device Management (MDM) solutions for the telecom industry, announced a new version of the company’s Short Message Service Centre (SMSC) with a built-in anti-spam protection filter based on machine learning and firewall. (more…)
February 7, 2018
Posted by: Zenobia Hegde
Advantech has released its latest ROM-7510 Qseven module. It is powered by TI’s AM5728, consisting of dual ARM® Cortex®-A15 microprocessors and dual TI C66x™ DSP processors, enabling high computing processing capability, accelerated multimedia, and industrial communication. (more…)
February 6, 2018
Posted by: Zenobia Hegde
PTC announced that Colfax Corporation, a globally recognised manufacturing and engineering technology company, has selected the ThingWorx® Industrial Innovation Platform powered by Microsoft Azure to align its Internet of Things (IoT) efforts and increase the pace of development. (more…)
February 2, 2018
Posted by: Zenobia Hegde
Business leaders are increasingly recognising the importance of conditions external to their organisation when it comes to facilitating successful digital transformation initiatives. And in a continent as vast as Europe, businesses can choose from numerous locations when deciding where to operate. (more…)
Posted by: Zenobia Hegde
Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, says that the Digi® XBee3™ series of next-generation RF modules and cellular modems is now available. (more…)
January 31, 2018
Posted by: Zenobia Hegde
Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)
January 30, 2018
Posted by: Zenobia Hegde
Frontier Smart Technologies, a supplier of digital audio technologies, announces design wins for models from three companies (Altec Lansing, Memorex and Spectra Merchandising International) for its Smart Audio platform. (more…)
January 29, 2018
Posted by: Zenobia Hegde
Bezel-less and edge-to-edge designs are rapidly becoming the norm, allowing OEMs to squeeze larger displays into a more compact form factor. However, optimising one-handed usability and adding value through smart implementations of edge interactions is becoming critical. (more…)
Posted by: Zenobia Hegde
LEI TECHNOLOGY, North American subsidiary of Lanner Electronics Inc and a IoT-Ready industrial computing hardware manufacturer, announced that its powerful embedded box PC, LEC-2580P, has earned the PTCRB wireless communication certification, (more…)
January 26, 2018
Posted by: Zenobia Hegde
As the need for complex, differentiated use cases for wearable devices grows, so too will their size and weight increase causing discomfort to users wanting to wear them daily. A recent study from the User Experience Strategies (UXS) service at Strategy Analytics “UXS Technology Planning Report: Wearables”, (more…)
January 25, 2018
Posted by: Zenobia Hegde