Ezurio (formerly Laird Connectivity), has released a family of Bluetooth LE modules based on Nordic Semiconductor’s new next generation of low power wireless SoC, the nRF54L15. The modules enable wireless product designers to bring new products to market faster, while delivering the highest level of performance, security and efficiency with ultra-low power consumption. The modules are predominantly designed for industrial, medical and commercial applications.
The ‘BL54L15 Series’ utilises the QFN48 package of Nordic’s nRF54L15 SoC. It features 31 GPIOs and comprises two module variants, that have either an integrated PCB trace antenna or a MHF4 connector on board. Both modules come in a 14 by 10 mm form factor.
The ‘BL54L15µ Series’ utilises the WSCLP package of the nRF54L15 SoC. It features 32 GPIOs and comprises two module variants that have either an integrated chip antenna or a trace pad for external antenna support. The modules come in a highly compact 6.3 by 7.9 mm form factor.
Each series of modules is optimised for high-performance applications, ensuring secure, robust and efficient wireless communication with support for the latest Bluetooth standards and secure programming options.
“The Bl54L15 and BL54L15µ module variants bring out the full capability of the market-leading, underlying Nordic silicon for the end customer to utilize in a fully pre-certified solution,” said Jonathan Kaye, the VP of product management and marketing at Ezurio. “The plethora of protocols and application support in a single hardware/software solution enables us to support the widest possible set of use cases and customer requirements for short range wireless connectivity.”
November 15, 2024
Posted by: Magda Dabrowska
Digi International has announced that the Digi Connect Sensor XRT-M, powered by Digi Axess, has been officially certified for use on the T-Mobile network. (more…)
November 14, 2024
Posted by: Magda Dabrowska
Eurotech has launched ReliaGATE 15A-14, the cybersecure modular edge gateway designed to meet the growing demand for secure, flexible and globally deployable IoT solutions. Built to support a wide range of applications, the ReliaGATE 15A-14 accelerates IoT projects by simplifying compliance with regional and carrier certifications, providing native support for field asset integration and meeting stringent security standards. (more…)
Posted by: Magda Dabrowska
InnoPhase IoT and TDK InvenSense have announced an end-to-end sensor-to-cloud platform that combines the Talaria TWO (T2) Wi-Fi SoC and TDK InvenSense’s ICU-30201 ultra-long-range ultrasonic time-of-flight range sensor. The integration provides direct connectivity to the cloud without needing external MCUs, lowers power consumption and total cost of ownership, and dramatically increases battery life. The solution targets applications such as smart locks, video cameras, access control systems and others for Smart Homes, Building Automation and Industrial IoT. (more…)
November 13, 2024
Posted by: Magda Dabrowska
SmartSense by Digi, part of Digi International has announced its achievement of SOC 2 Type II certification, an industry compliance standard designed to enable and enforce robust data security measures across enterprise environments. This underscores the SmartSense organisation’s dedication to ensuring customer data remains secure, private and confidential through enhanced data protection and operational standards that support both regulatory and quality assurance. By receiving SOC 2 Type II certification at the organisation level, SmartSense removes internal approval friction for their customers and accelerates their return on investment and programme success outcomes. (more…)
Posted by: Magda Dabrowska
The Digital Twin Consortium (DTC) has announced that the University of Central Florida (UCF) Research Foundation has joined DTC. UCF Research Foundation has also agreed to be the Regional Branch Organiser (RBO) for Southeast USA As an RBO, the UCF Research Foundation will facilitate and drive local DTC engagements and activities with regional industry, government and academic institutions on behalf of the consortium. (more…)
November 12, 2024
Posted by: Magda Dabrowska
Alif Semiconductor has released an board for its new Balletto product, the Bluetooth Low Energy (BLE) wireless microcontroller to feature hardware optimisation for AI/ML workloads. (more…)
November 11, 2024
Posted by: Magda Dabrowska
Murata has unveiled the connectivity module to apply the new SGP.32 Remote SIM Provisioning (RSP) specification of integrated SIM (iSIM) technology. This novel solution is built upon Murata’s innovative Type 2GD Cat.M1/NB-IoT connectivity module supporting ETSI/3GPP Release 17 standard and Giesecke+Devrient’s (G+D) highly-secure SGP.32-compliant SIM OS. (more…)
November 8, 2024
Posted by: Magda Dabrowska
HTEC has announced the acquisition of eesy-innovation, embedded hardware and software engineering company based in Munich, Germany, and Granada, Spain. This acquisition is part of HTEC’s overall strategy to further enhance its capabilities in embedded and IoT technologies and AI solutions, creating additional value for clients and providing growth opportunities for the talent of both companies. At the same time, this acquisition further strengthens HTEC’s footprint in the EU, and especially DACH region. (more…)
Posted by: Magda Dabrowska
Itron has added Verizon Network Continuity solutions to Itron’s Intelligent Connectivity suite with multi-network embedded SIM (eSIM) technology. This collaboration enables more reliable and resilient communications across broader geographies. (more…)
November 7, 2024
Posted by: Magda Dabrowska