InnoPhase IoT and TDK InvenSense have announced an end-to-end sensor-to-cloud platform that combines the Talaria TWO (T2) Wi-Fi SoC and TDK InvenSense’s ICU-30201 ultra-long-range ultrasonic time-of-flight range sensor. The integration provides direct connectivity to the cloud without needing external MCUs, lowers power consumption and total cost of ownership, and dramatically increases battery life. The solution targets applications such as smart locks, video cameras, access control systems and others for Smart Homes, Building Automation and Industrial IoT. (more…)
November 13, 2024
Posted by: Magda Dabrowska
SmartSense by Digi, part of Digi International has announced its achievement of SOC 2 Type II certification, an industry compliance standard designed to enable and enforce robust data security measures across enterprise environments. This underscores the SmartSense organisation’s dedication to ensuring customer data remains secure, private and confidential through enhanced data protection and operational standards that support both regulatory and quality assurance. By receiving SOC 2 Type II certification at the organisation level, SmartSense removes internal approval friction for their customers and accelerates their return on investment and programme success outcomes. (more…)
Posted by: Magda Dabrowska
The Digital Twin Consortium (DTC) has announced that the University of Central Florida (UCF) Research Foundation has joined DTC. UCF Research Foundation has also agreed to be the Regional Branch Organiser (RBO) for Southeast USA As an RBO, the UCF Research Foundation will facilitate and drive local DTC engagements and activities with regional industry, government and academic institutions on behalf of the consortium. (more…)
November 12, 2024
Posted by: Magda Dabrowska
Alif Semiconductor has released an board for its new Balletto product, the Bluetooth Low Energy (BLE) wireless microcontroller to feature hardware optimisation for AI/ML workloads. (more…)
November 11, 2024
Posted by: Magda Dabrowska
Murata has unveiled the connectivity module to apply the new SGP.32 Remote SIM Provisioning (RSP) specification of integrated SIM (iSIM) technology. This novel solution is built upon Murata’s innovative Type 2GD Cat.M1/NB-IoT connectivity module supporting ETSI/3GPP Release 17 standard and Giesecke+Devrient’s (G+D) highly-secure SGP.32-compliant SIM OS. (more…)
November 8, 2024
Posted by: Magda Dabrowska
HTEC has announced the acquisition of eesy-innovation, embedded hardware and software engineering company based in Munich, Germany, and Granada, Spain. This acquisition is part of HTEC’s overall strategy to further enhance its capabilities in embedded and IoT technologies and AI solutions, creating additional value for clients and providing growth opportunities for the talent of both companies. At the same time, this acquisition further strengthens HTEC’s footprint in the EU, and especially DACH region. (more…)
Posted by: Magda Dabrowska
Itron has added Verizon Network Continuity solutions to Itron’s Intelligent Connectivity suite with multi-network embedded SIM (eSIM) technology. This collaboration enables more reliable and resilient communications across broader geographies. (more…)
November 7, 2024
Posted by: Magda Dabrowska
Reconext has announced the appointment of Shahriyar Rahmati as the chief executive officer, effective immediately. Rahmati brings extensive leadership experience and a vision that aligns with Reconext’s mission and ambitions for future growth. (more…)
Posted by: Magda Dabrowska
Peachtree Corners has announced a collaboration with Opsys to launch and deploy the company’s Advanced LiDAR Technology Opsys Sensors (ALTOS) Gen 2 LiDAR at Curiosity Lab. This marks Opsys’ first real-world deployment of the ALTOS, the company’s first deployment with a municipality and the company’s first deployment in the United States. (more…)
November 6, 2024
Posted by: Magda Dabrowska
Posted by: Magda Dabrowska