In the not-so-distant future, IoT systems will act like social networks, with billions of connected devices communicating with each other, open sharing of information and unparalleled collaboration between products, services and organisations. (more…)
January 31, 2018
Posted by: IoT global network
Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, says that the Digi® XBee3™ series of next-generation RF modules and cellular modems is now available. (more…)
Posted by: Zenobia Hegde
PTC announced it has partnered with Microsoft to make available the ThingWorx® Industrial Innovation Platform on the Microsoft Azure cloud platform, capitalising on the two companies’ complementary technologies and together targeting opportunities in industrial sectors, including manufacturing. (more…)
Posted by: Zenobia Hegde
EIT Digital supported High Impact Initiative (HII) OEDIPUS keeps delivering results. As part of the HII’s activity “Robot IoT Interface”, CEA LIST Institute, Agileo Automation, Isybot, DFKI and Siemens, have leveraged joint entrepreneurial innovation to develop the ModBox, (more…)
Posted by: Zenobia Hegde
Alpha Micro Components announced the availability of the new Laird 60 Series of certified 802.11ac 2×2 MU-MIMO Wi-Fi and Bluetooth v4.2 modules. The 60 Series modules are based on cutting-edge manufacturing techniques, which not only help developers and designers get the most out of today’s most powerful wireless connectivity technologies, (more…)
Posted by: Zenobia Hegde
UK-based Bodle Technologies, an Oxford University spin-out company, is aiming to transform how and where we interact with displays after attracting £6 million (€6.80 million) in Series A funding. (more…)
January 30, 2018
Posted by: Zenobia Hegde
Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)
Posted by: Zenobia Hegde
Huawei signed a mutual co-operation agreement with UnionPay International with the aim of working together to promote the globalisation of Huawei Pay and to accelerate its roll-out worldwide in order to provide a better mobile payment experience for Huawei mobile device users. (more…)
Posted by: Zenobia Hegde
International lighting design company Klaasen Lighting Design (KLD), which has offices in Singapore, Perth, Shanghai and Jakarta, has entered into a partnership agreement with US-based data platform provider Gooee. (more…)
Posted by: Zenobia Hegde
In an effort to radically improve precision for low-power Internet of Things (IoT) tracking, start-up firm hoopo announced the launch of the company and its geolocation solution for low-power wide area (LPWA) networks. (more…)
Posted by: Zenobia Hegde