Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, has announced it is collaborating with partners including The Things Industries on new solutions. They combine cellular and LoRaWAN technologies to enable more IoT use cases, faster adoption, easier integration and quicker time-to-market (more…)
March 9, 2023
Posted by: Shriya Raban
San Francisco, United States – Samsara Inc., has announced that the Samsara Connected Operations Cloud was selected by Estes Express Lines, a privately-owned freight carrier in North America. Estes leverages Samsara to provide customer and employee experiences while improving the safety, efficiency, and sustainability of its operations. (more…)
Posted by: Janmesh Chintankar
Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)
March 3, 2023
Posted by: Shriya Raban
Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)
Posted by: Shriya Raban
Today, Commission has presented a set of actions aimed to make Gigabit connectivity available to all citizens and businesses across the EU by 2030, in line with the objectives of Europe’s Digital Decade, and to enable the transformation of the connectivity sector in the EU. (more…)
Posted by: Shriya Raban
Hologram, an IoT cellular connectivity platform, has announced the next-generation Hyper SIM with network fallback. The global eUICC SIM enables direct integrations with carriers in the US and Canada and the launch of network fallback to intelligently keep devices connected. The combination of carrier offerings and automatic fallback gives exceptional performance for IoT applications and peace of mind with multi-network redundancy. (more…)
Posted by: Shriya Raban
Adobe has announced a collaboration with Qualcomm Incorporated to help fuel its digital strategy and that of its affiliated companies. (more…)
March 2, 2023
Posted by: Shriya Raban
L&T Technology Services Limited, a global pure-play engineering services company, has announced it has been selected by Thales to offer 5G driven next-gen connectivity solutions, which will include collaboration with Qualcomm Technologies, Inc., allowing it to provide solutions for the benefit of urban railway operators. (more…)
Posted by: Shriya Raban
NTT Corporation has developed an ultra-compact baseband amplifier IC module with an ultra-broadband performance of 100GHz. This technology is expected to be used in future all-photonics networks, namely IOWN and 6G, and fields achieving measurements since they will require an ultra-broadband signal amplification function rid of distortion. (more…)
March 1, 2023
Posted by: Shriya Raban
The Linux Foundation, a nonprofit organisation focused on fostering innovation through open source, has announced an open sourcing of two new 5G projects, ProD3 and SEDIMENT, from Peraton Labs. Peraton Labs is a provider of applied research unit of Peraton a mission capability integrator and transformative enterprise IT provider. Both projects will now be hosted at the Linux Foundation as part of its broad portfolio of networking projects. (more…)
Posted by: Shriya Raban