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Press Releases

Infineon’s SECORA connect can make anything a wallet, new technologies will make contactless payment easier in the future

Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market provider of security semiconductors, Infineon Technologies AG is now driving this development forward with its SECORA Connect portfolio. New chips whose smallest versions are less than half the size of ladybugs open up possibilities for manufacturers to turn even small everyday objects into contactless means of payment.

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March 9, 2023

Posted by: Shriya Raban

Sonde Health, MassGen selected for MassAITC pilot study to examine use of voice in remote detection

Sonde Health, a health technology company committed to bringing accessible health monitoring to everyone, in conjunction with the Massachusetts General Hospital (MGH) Frontotemporal Disorders (FTD) Unit. The MGH has been selected by the Massachusetts Artificial Intelligence and Technology Centre for Connected Care in Aging & Alzheimer’s Disease (MassAITC) to lead a pilot study focused on leveraging vocal biomarkers for remote detection and monitoring of mild cognitive impairment in the home environment. (more…)

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Posted by: Shriya Raban

Semtech, The Things Industries collaborate to bring LoRaWAN, cellular solutions to market

Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, has announced it is collaborating with partners including The Things Industries on new solutions. They combine cellular and LoRaWAN technologies to enable more IoT use cases, faster adoption, easier integration and quicker time-to-market (more…)

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Posted by: Shriya Raban

Power over Ethernet switch adds advanced network, security features for outdoor applications

Chandler, United States – PoE switches designed for outdoor use in smart buildings and cities enable services ranging from public Wi-Fi and video surveillance to connected streetlights that increasingly need better reliability and cybersecurity protection. Extending the industry’s family of PoE switches with the high industry-standard outdoor protection for these applications, Microchip Technology Inc., has announces its PDS-204GCO switch that adds increased cyber protection plus the redundancy required for high network availability in mission-critical applications with long-distance connectivity. (more…)

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Posted by: Janmesh Chintankar

Huawei launches 50G POL prototype for next-generation Wi-Fi 7 campus networks

Barcelona, Spain – During the Mobile World Congress 2023 (MWC 2023), Huawei launched 50G POL prototype to help industry customers build next-generation Wi-Fi 7 campus networks. (more…)

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Posted by: Janmesh Chintankar

Adtran claims record for single-carrier 800G long-haul transport

New York, United States – Adtran, Inc., a provider of next-generation open and disaggregated networking solutions, announced that it has completed a field trial of 800Gbit/s single-carrier transport, achieving error-free transmission over a record distance of 2,220km in NYSERNet’s production network. The test route passed through 14 route-and-select flexgrid ROADMs comprising a total of 28 wavelength-selective switches. (more…)

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March 6, 2023

Posted by: Janmesh Chintankar

Telit Cinterion expands 5G LPWA module portfolio with new modules featuring Sony’s altair ALT1350 chipset

Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)

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March 3, 2023

Posted by: Shriya Raban

Rohde & Schwarz, Broadcom extend test collaboration for latest Wi-Fi 7 access point chipsets

Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)

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Posted by: Shriya Raban

European Commission aims to deliver Gigabit connectivity to citizens, businesses across EU

Today, Commission has presented a set of actions aimed to make Gigabit connectivity available to all citizens and businesses across the EU by 2030, in line with the objectives of Europe’s Digital Decade, and to enable the transformation of the connectivity sector in the EU. (more…)

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Posted by: Shriya Raban

Hologram announces Hyper SIM with network fallback cellular IoT connectivity on a single eUICC SIM

Hologram, an IoT cellular connectivity platform, has announced the next-generation Hyper SIM with network fallback. The global eUICC SIM enables direct integrations with carriers in the US and Canada and the launch of network fallback to intelligently keep devices connected. The combination of carrier offerings and automatic fallback gives exceptional performance for IoT applications and peace of mind with multi-network redundancy. (more…)

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Posted by: Shriya Raban