PTC announced that Colfax Corporation, a globally recognised manufacturing and engineering technology company, has selected the ThingWorx® Industrial Innovation Platform powered by Microsoft Azure to align its Internet of Things (IoT) efforts and increase the pace of development. (more…)
February 2, 2018
Posted by: Zenobia Hegde
To become part of the closed GSMA eSIM ecosystem, all applicants – meaning eSIMs, servers, and devices – must prove that they meet the GSMA requirements. “This ensures that the individual players authorise each other as ‘interlocutors’ and that they are able to communicate,“ explains Dr. Frank Oberhokamp, product manager eUICC Consumer Devices Test Solutions at Comprion.
February 1, 2018
Posted by: Zenobia Hegde
Chirp, a data-over-sound provider, along with partner EDF Energy, has been awarded £100,000 (€114206.50) by Innovate UK to trial a new project taking place at the company’s Heysham 1 power station. (more…)
Posted by: Zenobia Hegde
Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, says that the Digi® XBee3™ series of next-generation RF modules and cellular modems is now available. (more…)
January 31, 2018
Posted by: Zenobia Hegde
EIT Digital supported High Impact Initiative (HII) OEDIPUS keeps delivering results. As part of the HII’s activity “Robot IoT Interface”, CEA LIST Institute, Agileo Automation, Isybot, DFKI and Siemens, have leveraged joint entrepreneurial innovation to develop the ModBox, (more…)
Posted by: Zenobia Hegde
Alpha Micro Components announced the availability of the new Laird 60 Series of certified 802.11ac 2×2 MU-MIMO Wi-Fi and Bluetooth v4.2 modules. The 60 Series modules are based on cutting-edge manufacturing techniques, which not only help developers and designers get the most out of today’s most powerful wireless connectivity technologies, (more…)
Posted by: Zenobia Hegde
UK-based Bodle Technologies, an Oxford University spin-out company, is aiming to transform how and where we interact with displays after attracting £6 million (€6.80 million) in Series A funding. (more…)
January 30, 2018
Posted by: Zenobia Hegde
Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)
Posted by: Zenobia Hegde
Huawei signed a mutual co-operation agreement with UnionPay International with the aim of working together to promote the globalisation of Huawei Pay and to accelerate its roll-out worldwide in order to provide a better mobile payment experience for Huawei mobile device users. (more…)
Posted by: Zenobia Hegde
International lighting design company Klaasen Lighting Design (KLD), which has offices in Singapore, Perth, Shanghai and Jakarta, has entered into a partnership agreement with US-based data platform provider Gooee. (more…)
Posted by: Zenobia Hegde