Herndon, Va. 2 November, 2021 – ST Engineering iDirect, a global provider of satellite communications, announced that Kacific, a satellite broadband operator in Asia Pacific, has successfully deployed its pioneering Mx-DMA MRC (Multi Resolution Coding) technology in conjunction with its Ka-band satellite, Kacific1, to provide high-speed, low-cost, ultra-reliable broadband to rural and suburban areas of the Pacific and Southeast Asia. (more…)
November 2, 2021
Posted by: Anasia D'mello
Tokyo, Japan, October 28, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced it has entered into a definitive agreement with Celeno Communications, a provider of smart Wi-Fi solutions, for Renesas to acquire Celeno in an all-cash transaction. The deal values Celeno at approximately US$315 million (€269.87 million or approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar), assuming certain milestone payments are made as detailed in the agreement.
(more…)
October 28, 2021
Posted by: Anasia D'mello
Edinburgh, UK. 27 October, 2021 – IOTech, the edge software company, is collaborating with Building System Integrators, which specialises in the design, development and commissioning of building automation solutions, to increase the control and management capabilities for systems including HVAC, BAS and EMS. (more…)
Posted by: Anasia D'mello
27 October, 2021 – GlobalPlatform, the standard for secure digital services and devices, has announced the appointment of Ana Tavares Lattibeaudiere as executive director. Ana brings 20+ years of industry knowledge, non-profit strategy and business development to the role. After spells at Accenture, BCG and Deloitte, Ana spent 15 years in various roles at GSMA. Most recently she held the position of head of North America, responsible for driving global initiatives across eSIM, future networks, IoT, RCS, identity and diversity. (more…)
October 27, 2021
Posted by: Anasia D'mello
LONDON, UK. 26 October 2021 – RS Components (RS), a trading brand of Electrocomponents plc, a global omni-channel provider of product and service solutions, has announced availability of a complete series of circular connectors manufactured by CONEC Elektronische Bauelemente GmbH, part of the Amphenol Group. (more…)
October 26, 2021
Posted by: Anasia D'mello
Hampshire, UK. 26th October 2021 – A new study by Juniper Research has found that the smart hospitals market will be worth $59 billion (€50.78 billion) by 2026, up from $29 billion (€24.96 billion) in 2021; representing an average annual growth of 15%. The concept of the smart hospital includes healthcare providers leveraging advanced analytics, connected devices, and healthcare platforms to improve care, productivity, and operational efficiency. (more…)
Posted by: Anasia D'mello
Dusseldorf, October 26, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that its R-Car H3 and R-Car M3 system-on-chips (SoCs) have been adopted by Toyota Motor Corporation for their next-generation multimedia systems. (more…)
Posted by: Anasia D'mello
Munich, Germany. 25 October, 2021 – Using energy responsibly is the essential factor for innovations in the field of energy efficiency towards a greener planet. Infineon Technologies AG, the market provider of power semiconductors, is continuously investing and innovating in futureproof semiconductor technologies and solutions, enabling environmentally friendly applications as well as performance and ease of design. (more…)
October 25, 2021
Posted by: Anasia D'mello
Lanner was approached by a customer searching for the ideal hardware appliance capable of supporting the deployment of a K-12 education system, one that serves millions of students and teaching staff residing both inside and outside the country. (more…)
October 22, 2021
Posted by: Anasia D'mello
Düsseldorf. October 21, 2021 ― Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth® 5.3 Low Energy (LE) Specification.
Posted by: Anasia D'mello