Telit Cinterion, a global provider of the intelligent edge, has announced new ultra-compact 5G low-power wide area (LPWA) modules for a wide variety of indoor and outdoor IoT applications that require long battery life and long service life. The modules feature the ALT1350 chipset from Sony Semiconductor Israel (Sony), a chipset that supports both unlicensed spectrum and satellite connectivity in a single chipset, enabling faster development, lower power, smaller size and new use cases. (more…)
March 3, 2023
Posted by: Shriya Raban
Rohde & Schwarz and Broadcom have validated the R&S CMP180 radio communication tester for production testing of the latest Broadcom Wi-Fi 7 access point chipsets. A Wi-Fi 7 test setup with the R&S CMP180 and a Broadcom Wi-Fi 7 device will be demonstrated at the Rohde & Schwarz booth at the Mobile World Congress 2023 in Barcelona. (more…)
Posted by: Shriya Raban
Today, Commission has presented a set of actions aimed to make Gigabit connectivity available to all citizens and businesses across the EU by 2030, in line with the objectives of Europe’s Digital Decade, and to enable the transformation of the connectivity sector in the EU. (more…)
Posted by: Shriya Raban
Hologram, an IoT cellular connectivity platform, has announced the next-generation Hyper SIM with network fallback. The global eUICC SIM enables direct integrations with carriers in the US and Canada and the launch of network fallback to intelligently keep devices connected. The combination of carrier offerings and automatic fallback gives exceptional performance for IoT applications and peace of mind with multi-network redundancy. (more…)
Posted by: Shriya Raban
Adobe has announced a collaboration with Qualcomm Incorporated to help fuel its digital strategy and that of its affiliated companies. (more…)
March 2, 2023
Posted by: Shriya Raban
L&T Technology Services Limited, a global pure-play engineering services company, has announced it has been selected by Thales to offer 5G driven next-gen connectivity solutions, which will include collaboration with Qualcomm Technologies, Inc., allowing it to provide solutions for the benefit of urban railway operators. (more…)
Posted by: Shriya Raban
New York, United States –Â Transit Wireless, a BAI Communications company and 5G wireless infrastructure provider, announced that the network expansion partnership with the Metropolitan Transportation Authority (MTA) will double the size of Transit Wireless’ 5G fibre network including 418 track miles and up to 20 separate river crossings. (more…)
Posted by: Janmesh Chintankar
Austin, United States – Abracon, LLC, a provider in passive components, announces the new product release for the ultra-wideband (UWB) antennas, including the ultra-wide band 3.3 – 7.2 GHz chip antenna, the ultra-wide band 3.7 – 4.2 GHz chip antenna, and the ultra-wide band 6.2 – 8.2 GHz chip antenna solutions. (more…)
Posted by: Janmesh Chintankar
Barcelona, Spain –Â D-Link, a provider in connecting people, businesses, and cities with computer networking solutions and technology, showcased the latest products for the key themes of Private 5G O-RAN, M2M (machine-to-machine), enterprise solutions and smart home, aiming to fully realise the potential of connectivity and shape the IoT world of tomorrow. (more…)
Posted by: Janmesh Chintankar
NTT Corporation has developed an ultra-compact baseband amplifier IC module with an ultra-broadband performance of 100GHz. This technology is expected to be used in future all-photonics networks, namely IOWN and 6G, and fields achieving measurements since they will require an ultra-broadband signal amplification function rid of distortion. (more…)
March 1, 2023
Posted by: Shriya Raban