Press Releases

Nordic Semiconductor’s nRF9151 cellular IoT module enhances IIJ SoftSIM capabilities in Japan

Nordic Semiconductor’s nRF9151 low power module for advanced cellular Internet of Things (IoT) applications now includes SoftSIM support for Japan’s only SoftSIM provider, Internet Initiative Japan Inc. (IIJ). By using a SoftSIM instead of a traditional SIM, product developers can reduce SIM and Bill of Materials (BoM) costs, simplify design and lower power consumption for cellular IoT end products based on Nordic’s nRF9151 module. SoftSIM is ideal for space-constrained cellular IoT devices with low power consumption requirements, such as wearables and smart sensors.

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April 21, 2025

Posted by: Marion Webber

ORBCOMM launches SKYWAVE Connect partner program to accelerate channel partner growth

ORBCOMM has announced the launch of the SKYWAVE Connect partner program, which enables Internet of Things (IoT) solution providers, system integrators, value-added resellers and other channel partners to accelerate their IoT solution development, expand their market reach and take advantage of new growth opportunities. The program launched in select regions with a global rollout to follow later this year.

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April 17, 2025

Posted by: Marion Webber

Trusted Connectivity Alliance updates eSIM specification to enhance secure remote SIM provisioning for 5G and constrained IoT devices

Trusted Connectivity Alliance (TCA) has released Version 3.4 of its eUICC Profile Package: Interoperable Format Technical Specification (Interoperable Profile Package Specification). The latest version includes updates to support full alignment with 3GPP Release 18 to enable advanced 5G functionality and secure authentication in 5G network slicing, as well as enabling the remote management of eSIM profiles on low-power and network-constrained devices. Additional updates and clarifications to promote security and interoperability have also been made.

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April 3, 2025

Posted by: Marion Webber

Global InsurTech Summit set to host industry’s leading innovators

FinTech Global, a specialist research firm, is set to host the highly-anticipated Global InsurTech Summit on April 30, 2025, bringing the InsurTech greatest innovators together.

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March 28, 2025

Posted by: Marion Webber

Gateworks joins NXP Gold Partner Program | Strengthening leadership in embedded technology

Gateworks Corporation, a contributor in industrial Single Board Computers (SBCs), has announced their inclusion in the NXP Semiconductors Gold Partner Program. This partnership strengthens Gateworks’ position as a key player in the embedded market, enabling faster development and deployment of high-performance solutions for industrial IoT, automation and more.

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March 20, 2025

Posted by: Marion Webber

Soracom and Suzuki's Versatile micro e-Mobility Platform concept

Soracom and Suzuki launch IoT-based proof-of-concept for commercialisation of Versatile Micro e-Mobility platform concept

Soracom, Inc., a global IoT platform provider with full MVNO capability, and Suzuki Motor Corporation, a multinational mobility manufacturer, have launched a proof-of-concept (PoC) using Internet of Things (IoT) to commercialise Suzuki’s “Versatile micro e-Mobility Platform concept,” which applies electric wheelchair technology to provide mobility solutions for various robots.

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March 19, 2025

Posted by: Marion Webber

Thales selects Wireless Logic as IoT partner

Wireless Logic, a contributor in Internet of Things (IoT) connectivity solutions has been selected by Thales, a contributor in advanced eSIM technologies to enable secure, scalable and resilient IoT connectivity across diverse regions worldwide.

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March 18, 2025

Posted by: Marion Webber

IoT sign ona blue and orange background

SG Wireless deepens manufacturing partnership to provide solution for OEMs’ supply chain and country-of-origin concerns

SG Wireless Limited, an Internet of Things (IoT) technology solutions provider, has announced the solidification of its partnership with parent company Season Group to provide customers with a comprehensive, one-stop solution for contract manufacturing of IoT device designs.

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March 13, 2025

Posted by: Marion Webber

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Renesas and Applus+ achieve PSA Certified Level 1 with CRA extension for three MCU groups

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced that it has obtained PSA Certified Level 1 certification with the European Cyber Resilience Act (CRA) compliance extension for three of its latest microcontroller groups (MCUs). This certification, evaluated by Applus+ Laboratories, marks a step in Renesas’ commitment to cybersecurity and compliance with upcoming European regulations.

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March 3, 2025

Posted by: Marion Webber

A person sitting in a connected car

Thales partners with Cubic to launch next-generation eSIM solutions for connected vehicles

Thales, a global contributor in advanced technologies, and Cubic, a global provider of software-defined vehicle (SDV) solutions, have announced a collaboration to drive innovation and simplify connectivity management. Using Thales’s eSIM management platform, Cubic will enhance its eSIM solution capabilities to align with the latest GSMA standards, ensuring global connectivity across industries such as automotive, transportation and agriculture.

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February 28, 2025

Posted by: Marion Webber