Trusted Connectivity Alliance (TCA) has released Version 3.4 of its eUICC Profile Package: Interoperable Format Technical Specification (Interoperable Profile Package Specification). The latest version includes updates to support full alignment with 3GPP Release 18 to enable advanced 5G functionality and secure authentication in 5G network slicing, as well as enabling the remote management of eSIM profiles on low-power and network-constrained devices. Additional updates and clarifications to promote security and interoperability have also been made.
April 3, 2025
Posted by: Marion Webber
FinTech Global, a specialist research firm, is set to host the highly-anticipated Global InsurTech Summit on April 30, 2025, bringing the InsurTech greatest innovators together.
March 28, 2025
Posted by: Marion Webber
Gateworks Corporation, a contributor in industrial Single Board Computers (SBCs), has announced their inclusion in the NXP Semiconductors Gold Partner Program. This partnership strengthens Gateworks’ position as a key player in the embedded market, enabling faster development and deployment of high-performance solutions for industrial IoT, automation and more.
March 20, 2025
Posted by: Marion Webber
Soracom, Inc., a global IoT platform provider with full MVNO capability, and Suzuki Motor Corporation, a multinational mobility manufacturer, have launched a proof-of-concept (PoC) using Internet of Things (IoT) to commercialise Suzuki’s “Versatile micro e-Mobility Platform concept,” which applies electric wheelchair technology to provide mobility solutions for various robots.
March 19, 2025
Posted by: Marion Webber
Wireless Logic, a contributor in Internet of Things (IoT) connectivity solutions has been selected by Thales, a contributor in advanced eSIM technologies to enable secure, scalable and resilient IoT connectivity across diverse regions worldwide.
March 18, 2025
Posted by: Marion Webber
SG Wireless Limited, an Internet of Things (IoT) technology solutions provider, has announced the solidification of its partnership with parent company Season Group to provide customers with a comprehensive, one-stop solution for contract manufacturing of IoT device designs.
March 13, 2025
Posted by: Marion Webber
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced that it has obtained PSA Certified Level 1 certification with the European Cyber Resilience Act (CRA) compliance extension for three of its latest microcontroller groups (MCUs). This certification, evaluated by Applus+ Laboratories, marks a step in Renesas’ commitment to cybersecurity and compliance with upcoming European regulations.
March 3, 2025
Posted by: Marion Webber
Thales, a global contributor in advanced technologies, and Cubic, a global provider of software-defined vehicle (SDV) solutions, have announced a collaboration to drive innovation and simplify connectivity management. Using Thales’s eSIM management platform, Cubic will enhance its eSIM solution capabilities to align with the latest GSMA standards, ensuring global connectivity across industries such as automotive, transportation and agriculture.
February 28, 2025
Posted by: Marion Webber
Berg Insight has found in its latest research that around 14.7 million people in Europe were using connected care solutions at the end of 2024. The figure refers to users of telecare and telehealth solutions in the EU27+3 countries. Until 2028, Berg Insight forecasts that the number of connected care users will grow at a compound annual growth rate (CAGR) of 11.8 percent to reach 23.0 million.
February 17, 2025
Posted by: Marion Webber
Munters has signed an agreement to divest the FoodTech Equipment offering to Grain and Protein Technologies (GPT), owned by American Industrial Partners (AIP), for MEUR 97.5 (approximately BSEK 1.1) on a cash and debt free basis.
February 10, 2025
Posted by: Marion Webber