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Nordic Semiconductor and Kigen have announced a technical collaboration that will accelerate Massive IoT deployments. The partnership combines Kigen eSIMs, Kigen’s eSIM IoT Remote Manager (eIM) solution for SGP.32 IoT eSIMs and Nordic’s award-winning nRF9151 System-in-Package (SiP). The collaboration underscores both companies’ commitment to offer robust, secure, low-power cellular IoT solutions that remove the technical barriers to wireless connectivity and enable rapid scalability of the IoT.

Nordic and Kigen will showcase their innovations at CES 2025, offering visitors demonstrations and in-depth discussions with their engineering teams. CES will be held in Las Vegas, NV, from 7 to 10 January 2025. Nordic can be found on booth #52039 at the Venetian Expo.

“The joint testing between Kigen eIM solution and Nordic Semiconductor’s nRF9151 reflects our shared commitment to innovation in low-power, compact, and battery-efficient IoT devices,” said Vincent Korstanje, the CEO, Kigen. “At Kigen, this is part of our vision to ensure that standards bring benefits to the broadest set of players – making this transformative technology accessible, cost-effective, and scalable for businesses of all sizes.”

Oyvind Birkenes, the EVP business unit long-range at Nordic Semiconductor, said, “The collaboration with Kigen has produced an outcome that’s much more than just an important technical milestone. Rather, the simplicity brought by Kigen’s solution combined with the highly integrated, low power and cost-efficient nRF9151 SiP has the potential to transform the cellular IoT landscape by making it easier and faster for all sizes of companies to deploy Massive IoT applications.”

A shared commitment to solutions for low-power, compact IoT designs

The collaboration between Nordic and Kigen exemplifies a shared commitment to delivering robustly tested, high-quality solutions for low power, compact IoT designs. Such products are critical for the success of Massive IoT deployments such as industrial automation, asset tracking and smart metering. The open and productive work has resulted in successful testing of the eIM platform and eSIM on the nRF9151 and sets the stage for further trials and support for commercial deployments in early 2025. Both Kigen’s eIM solution and Nordic’s nRF9151 are available now.

The GSMA’s SGP.32 standard simplifies Remote SIM Provisioning (RSP) for resource- and network-constrained low-power IoT devices. Designed to the latest specification (SGP.32v1.2), Kigen eIM brings capabilities to coordinate, streamline and simplify remote eSIM profile management for low-power IoT devices at scale. With the Kigen solution, SIM profile management and RSP are accessible to all small and medium enterprises (SMEs) making them broadly applicable to the Massive IoT market for the first time.

Nordic’s new Nordic Thingy:91 X with a Kigen eSIM connects to the eIM platform to perform SIM profile changes. Thingy:91 X is an advanced cellular IoT prototyping platform built around the nRF9151 SiP and supporting LTE-M, NB-IoT, GNSS, Bluetooth LE, Wi-Fi, and DECT NR+ wireless standards. For eSIM profile management and RSP development purposes, the Thingy:91 X resembles a low-power IoT device with an embedded application that communicates with the IoT Profile Assistant (IPA) in the eSIM to help supervise the full set of profile operations, including profile switch. The combination of Thingy:91 X, eSIM, and eIM solution is ideal for developers looking to fast-track IoT developments.

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