Remote SIM provisioning in low-power cellular modules for IoT/M2M devices enabled by Murata and Truphone collaboration
Steve Alder at Truphone
A collaboration between Murata and Truphone sees the companies combining their technologies and services in an effort to take a lead in the eSIM revolution for the Internet of Things (IoT) and Machine-to-Machine (M2M) devices.
The two companies are working at the forefront of transformative technologies. Murata is advancing a variety of IoT applications and has developed a low-power cellular module for IoT/M2M devices. These modules lower battery consumption, make space for device markers and reduce the cost of production.
The low-power Murata module incorporates ST Microelectronics’ ST33 M2M eSIM which is a fully compliant GSMA solution suitable for remote SIM provisioning. At 2×2 mm, the wafer level chip scale package (WLCSP) that the eSIM comes in is a remarkably small SIM card, paving the way for ever-smaller devices that are less prominent and provide a more seamless integration into their operating environment.
Truphone’s role has been to enable the module to connect out of the box to low-power wide-area technologies across numerous countries via its market-leading bootstrap connectivity technology implemented by the GSMA. In addition, the company has supplied its GSMA-accredited M2M remote SIM-provisioning application that, when integrated with the bootstrap connectivity, enables the device to obtain a SIM profile from other mobile operators allowing for continuous local connectivity.
Jim Philipp
Jim Philipp, senior marketing manager at Murata said: “The world of IoT devices is broad and complex, and especially so for narrow-band technologies. With this module, and the integration of technology from Truphone and ST, we’re simplifying the supply chain for anyone in the IoT market who wants powerful connectivity, cost-saving hardware and a geographical footprint to keep up with their business.”
Steve Alder, chief business development officer at Truphone said: “One barrier to mass adoption of IoT is the complexity device makers face in connecting their devices. This collaboration with Murata brings together all the elements, packaged together in a way that allows device makers to get connected simply and efficiently. With Truphone’s global bootstrap connectivity and remote SIM provisioning, device makers can manufacture a single worldwide model type for the globe, and then configure the device over the air to allow it to connect locally, wherever it is unboxed.”
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