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New Digi XBee3 series of smart edge IoT modules and modems announced by Digi International

Digi International®, a global provider of Internet of Things (IoT) connectivity products and services, says that the Digi® XBee3™ series of next-generation RF modules and cellular modems is now available. (more…)

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January 31, 2018

Posted by: Zenobia Hegde

PTC partners with Microsoft to help customers accelerate their digital transformations in IoT

PTC announced it has partnered with Microsoft to make available the ThingWorx® Industrial Innovation Platform on the Microsoft Azure cloud platform, capitalising on the two companies’ complementary technologies and together targeting opportunities in industrial sectors, including manufacturing. (more…)

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Posted by: Zenobia Hegde

EIT Digital launches new generation ModBox gateway

EIT Digital supported High Impact Initiative (HII) OEDIPUS keeps delivering results. As part of the HII’s activity “Robot IoT Interface”, CEA LIST Institute, Agileo Automation, Isybot, DFKI and Siemens, have leveraged joint entrepreneurial innovation to develop the ModBox, (more…)

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Posted by: Zenobia Hegde

The trilemma: Three tips for effective substation operation

The UK Government is facing a ‘trilemma’; a struggle to provide secure, affordable and clean energy, all while preventing blackouts. This is a unique situation where the technology available to the sector is much more advanced than the infrastructure the industry is built on. (more…)

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Posted by: Zenobia Hegde

Oxford firm Bodle secures £6m to introduce new IoT digital display technology

UK-based Bodle Technologies, an Oxford University spin-out company, is aiming to transform how and where we interact with displays after attracting £6 million (€6.80 million) in Series A funding. (more…)

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January 30, 2018

Posted by: Zenobia Hegde

Renesas Electronics expands RX130 MCU lineup to enhance functionality for touch-based home appliances

Renesas Electronics, a supplier of advanced semiconductor solutions, announced 38 new microcontrollers (MCUs) in its RX130 Group. The new MCUs extend flash memory size to 256 KB, 384 KB and 512 KB, and increase package size up to 100-pins to provide higher performance and compatibility with the RX231/RX230 Group of touch MCUs. (more…)

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Posted by: Zenobia Hegde

Huawei teams up with UnionPay International to roll out Huawei Pay worldwide

Huawei signed a mutual co-operation agreement with UnionPay International with the aim of working together to promote the globalisation of Huawei Pay and to accelerate its roll-out worldwide in order to provide a better mobile payment experience for Huawei mobile device users. (more…)

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Posted by: Zenobia Hegde

Klaasen Lighting Design partners with Gooee as IoT changes the way lighting projects are specified

International lighting design company Klaasen Lighting Design (KLD), which has offices in Singapore, Perth, Shanghai and Jakarta, has entered into a partnership agreement with US-based data platform provider Gooee. (more…)

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Posted by: Zenobia Hegde

IoT company hoopo launched to provide ‘low-power, accurate’ geolocation solutions for asset tracking

In an effort to radically improve precision for low-power Internet of Things (IoT) tracking, start-up firm hoopo announced the launch of the company and its geolocation solution for low-power wide area (LPWA) networks. (more…)

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Posted by: Zenobia Hegde

Italtel and Rold to collaborate on Industry 4.0 solutions

Italtel, a telecommunications company in IT system integration, managed services, Network Functions Virtualisation and Internet of Things solutions,and Rold Elettrotecnica, a household appliances component supplier, announced their co-operation in the field of Industry 4.0. (more…)

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January 29, 2018

Posted by: Zenobia Hegde