SPARK Microsystems joins FiRa Consortium for advancement of UWB wireless connectivity
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SPARK Microsystems, a Canadian fabless semiconductor company specialising in next-generation short-range wireless communications, has announced its membership in the FiRa Consortium. As an associate member, SPARK will align with vendors in the ultra-wideband (UWB) technology community to cultivate interoperability in wireless ranging and positioning.
SPARK will be an active participant in FiRa working groups and release initiatives, contributing its expertise and helping to develop specifications for an interconnected UWB ecosystem. As part of this engagement, SPARK will participate in the FiRa Consortium Demo Showcase in Montreal this evening (7PM, June 8, 2026) during the June Members Meeting. SPARK will host live demonstrations highlighting its LE-UWB (Low Energy UWB) technology for next-generation UWB applications.
“FiRa brings together wireless industry leaders and innovators to achieve the full benefits of interoperable, precise location awareness for people and devices,” said Rias Al-kadi, the vice chair of FIRA Consortium. “SPARK’s deep expertise and collaborative approach will help contribute to a cohesive, industry-aligned standard for UWB ranging and positioning.”
“SPARK’s commitment to standards-based interoperability reflects our dedication to enabling product innovators to transform how people connect with and interact within their environment,” said Frederic Nabki, the co-founder and chief technology officer of SPARK Microsystems. “UWB is the future of location awareness across a wide range of devices and applications, and SPARK is proud to support the FiRa Consortium in fulfilling this vision and beyond.”
For more information about SPARK’s LE-UWB wireless technology for high-performance, low-power communication, ranging and positioning in diverse consumer and industrial markets, visit SPARK’s website.
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